Main Article Content
This research presents a comprehensive methodology for investigating the free vibration and buckling behaviors of laminated composite and sandwich structures under thermal conditions using an ABAQUS-based finite element model (FEA). The study aims to advance the state-of-the-art in composite material analysis through five key objectives: proposing a finite element-based model, conducting free vibration and buckling analyses of laminated composites and sandwiches in plate and beam forms under thermal influence, and assessing the impact of various parameters on frequency and buckling load.The methodology involves four crucial steps: geometry modeling, mesh size determination through a convergence study, and subsequent analysis. A noteworthy achievement is the identification of a 16 × 16 mesh size as optimal for simulating a 10-layered square-shaped angle-ply SSSS laminated composite plate under thermal conditions, ensuring study accuracy.This research not only aligns with existing models but also advances them, enhancing its credibility. It notably emphasizes the role of ply-angle in non-dimensional natural frequency, finding that a 45° ply-angle yields the maximum non-dimensional frequency, regardless of the height-to-side-length ratio (h/a). This discovery holds practical implications for the design and manufacturing of laminated composite materials, especially in thermally challenging environments that may induce buckling or alter vibration behavior.While this research significantly contributes to understanding laminated composites under thermal conditions, it calls for future work. Opportunities include experimental validation, broader analyses encompassing different boundary conditions and thermal loading scenarios, and the exploration of multi-scale modeling approaches.In summary, this research sets a new benchmark in finite element analysis for laminated composites and sandwiches under thermal conditions. Its potential applications span across aerospace, automotive, and civil engineering fields, addressing critical concerns in the behavior of these materials under thermal loads.